Benchmark Electronics, Inc. (NYSE:BHE) is reporting second quarter financial results on Wednesday 29th July 2020, after market close.
According to analysts surveyed by Thomson Reuters, BHE is expected to report 2Q20 income of $ 0.09 per share from revenue of $ 474.33 million.
For the full year, analysts anticipate top line of $ 2026.99 million, while looking forward to income of $ 0.89 per share bottom line.
Previous Quarter Performance
Benchmark Electronics, Inc. reported income for the first quarter of $ 0.22 per share, from the revenue of $ 514.96 million. The consensus estimates are income of $ 0.16 per share from $ 510.00 million in revenue. The bottom line results beat street analysts by $ 0.06 or 37.50 percent, at the same time, top line results outshined analysts by $ 4.96 million or 0.97 percent.
Historical Earnings Performance
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Stock Performance
According to the previous trading day, closing price of BHE was $ 19.95, representing a 41.89 % increase from the 52 week low of $ 14.06 and a 46.6 % decrease over the 52 week high of $ 37.36.
The company has a market capital of $ 726.49 million and is part of the Technology sector and Contract Manufacturers industry.
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Conference Call
Benchmark Electronics, Inc. will be hosting a conference call at 5:00 PM eastern time on 29th July 2020, to discuss its 2Q20 financial results with the investment community. A live webcast with presentations will be available on the Internet by visiting the Company website www.bench.com
Benchmark Electronics, Inc., together with its subsidiaries, provides product design, engineering services, technology solutions, and advanced manufacturing services in the Americas, Asia, and Europe. The company offers engineering services and technology solutions, including new product design, prototype, testing, and related engineering services; and custom testing, and automation equipment design and build services. It also provides electronics manufacturing and testing services, such as printed circuit board assembly and test solutions, assembly of subsystems, circuitry and functionality testing of printed assemblies, environmental and stress testing, and component reliability testing; component engineering services; manufacturing defect analysis, in-circuit testing, functional testing, flexible test solutions, environmental stress tests of assemblies of boards or systems; and failure analysis.
