Lam Research Corporation (NASDAQ:LRCX) will begin trading ex-dividend on September 29, 2020. The quarterly dividend payment of $ 1.30 per share is scheduled to be paid on October 14, 2020. The dividend yield based on the latest trading day closing price was 1.57 %. Owners of shares, purchased before the ex-dividend date will be eligible for the dividend.
Dividends History
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Lam Research Corporation recently reported fourth quarter financial results on July 29, 2020, after market close, semiconductor equipment manufacturer came out with income for the fourth quarter of $ 4.78 per share, from the revenue of $ 2,792.00 million. The quarterly earnings developed 32.04 percent while revenues surged 18.25 percent compared with the same quarter last year.
Street analysts expected Lam Research Corporation recently reported fourth quarter financial results on July 29, 2020, after market close, semiconductor equipment manufacturer to report income of $ 4.05 per share on revenue of $ 2677.64 million for the fourth quarter. The bottom line results beat street analysts by $ 0.73 or 18.02 percent, at the same time, top line results outshined analysts by $ 114.36 million or 4.27 percent.
Stock Performance
Shares of Lam Research Corporation traded up $ 3.10 or 0.95 percent on Friday, reaching $ 330.27 with volume of 1.55 million shares. Lam Research Corporation has traded high as $ 331.89 and has cracked $ 322.00 on the downward trend
According to the previous trading day, closing price of $ 330.27, representing a 80.38 % increase from the 52 week low of $ 181.38 and a 15.61 % decrease over the 52 week high of $ 387.70.
The company has a market capital of $ 48.10 billion and is part of the Technology sector and Semiconductor Equipment & Materials industry.
Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits worldwide. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition product for copper damascene manufacturing; SOLA ultraviolet thermal processing products for film treatment; SPEED gapfill high-density plasma chemical vapor deposition (CVD) products; Striker single-wafer atomic layer deposition (ALD) products; and VECTOR plasma-enhanced CVD ALD products. It also provides Flex for dielectric etch applications; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes.
