KLA-Tencor Corporation (NASDAQ:KLAC) will begin trading ex-dividend on November 13, 2020. The quarterly dividend payment of $ 0.90 per share is scheduled to be paid on December 1, 2020. The dividend yield based on the latest trading day closing price was 1.54 percent. To secure the dividend payout, investors must buy the stock prior to the ex-dividend date of November 13, 2020.
Dividends History
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KLA-Tencor Corporation recently reported first quarter financial results on October 28, 2020, after market close, semiconductor equipment manufacturer posted income for the first quarter of $ 3.03 per share, from the revenue of $ 1,539.00 million. The quarterly earnings grew 22.18 percent while revenues developed 8.92 percent compared with the same quarter last year.
The consensus estimates are income of $ 2.77 per share from $ 1485.94 million in revenue. The bottom line results beat street analysts by $ 0.26 or 9.39 percent, at the same time, top line results outshined analysts by $ 53.06 million or 3.57 percent.
Stock Performance
Shares of KLA-Tencor Corporation traded up $ 9.78 or 4.37 percent on Wednesday, reaching $ 233.51 with volume of 983.30 thousand shares. KLA-Tencor Corporation has traded high as $ 234.13 and has cracked $ 225.99 on the downward trend
The closing price of $ 233.51, representing a 103.04 % increase from the 52 week low of $ 110.19 and a 7.78 % decrease over the 52 week high of $ 242.60.
The company has a market capital of $ 36.07 billion and is part of the Technology sector and Semiconductor Equipment & Materials industry.
KLA Corporation designs, manufactures, and markets process control and yield management solutions for the semiconductor and related nanoelectronics industries worldwide. The company offers chip and wafer manufacturing products, including defect inspection and review systems, metrology solutions, in situ process monitoring products, computational lithography software, and data analytics systems for chip manufacturers to manage yield throughout the semiconductor fabrication process. It also provides reticle manufacturing products, such as reticle inspection, metrology, and data analytics systems for mask shops; and packaging manufacturing products comprising standalone and cluster inspection and metrology systems for various applications in the field of semiconductor packaging.
